99.95% High purity SiAl sputtering Target
1.Detail:Content | Si: 90 wt% ,Al:10 wt% |
Purity | ≥99.95% |
Relative Density | ≥96% |
Resistivity | ≤10mΩ·cm |
Specification | length(max)4000mm*thickness(max)13mm; linearity:05.mm |
Processing Mode | Plasma spraying |
Application | Low emission glass |
Delivery time | 2 Weeks after receipt of deposit |
2.Why Us :
High purity | 99.9% |
Uniform composition | element Deviation Index ±2wt% |
Smaller grain | <100μm |
High density | 2.251g/cm |
Low resitivity | 7 mΩ·cm |
3: Production Workflow Chart
4:Packing :
According to customers' request.
5:Impurity Content:
Fe<=0.03% Cd<=0.0005% Pb<=0.0005% As<=0.0002%
Mn<=0.001% Cu<=0.0005% K<=0.001% Ca<=0.001%
6.Independent intelligent property right
6.Independent intelligent property right
We have obtained 11 independent intelligrnt property rights about sputtering targets and plasma spraying equipments .